According to BlockBeats, on July 5th, Intel is considering adopting an architecture that utilizes both front and back power supplies in its 1.4nm ultra-fine process to catch up with competitors. Industry sources indicate that Intel originally planned to use PowerDirect, a dedicated back-side power supply technology, in its 1.4nm base process 14A, but is considering introducing a dual-side architecture that uses both front and back power supplies in the subsequent 14A2 process.

Intel previously announced plans to improve chip density by 1.3 times over the 18A process in its 14A process. The target M0 pitch for the 14A process is approximately 28 nanometers, while the 14A2 process may push the M0 pitch to 21 nanometers through a half-node improvement. Intel will maintain the rear power supply network as the primary component while redistributing some front-end metal wiring for auxiliary power and clock signal purposes to compensate for insufficient power margins caused by miniaturization and exposure limitations.

Intel's 14A process is planned to enter risk production in 2028 and mass production in 2029. Intel needs to release the 14A process version 0.9 process design kit to external customers in October this year and secure confirmed orders from large fabless customers within the following 18 months. In contrast, TSMC plans to ship true 1.4nm A14 finished products in 2028, and Samsung Electronics plans to commercialize its improved 2nm SF2Z process, which uses back-side power supply technology, in 2027.